Add to ORKGABSTRACT: The influence of microstructure coarsening on thermomechanical fatigue behavior of eutectic solder joint is investigated by numerical simulation. A phase growth model is selected based on the experimental observation and incorporated in a damage me-chanics based viscoplastic constitutive model. Comparisons between the simulations with and without coarsening effect are made for isothermal, cyclic shear testing and thermal cy-cling of solder joints in BGA electronic packaging
The microstructure of solder plays a key role in the reliability of electronic packages. In this stu...
The effect of mechanical cycling fatigue damage and isothermal aging histories on the evolution of t...
As microelectronic package construction becomes more diverse and complex, the need for accurate, geo...
The thermomechanical fatigue failure of solder joints is increasingly becoming an important reliabil...
The most commonly used solder for electrical interconnects in electronic packages is the near eutect...
Thermal mechanical fatigue (TMF) is an important damage mechanism for solder joints exposed to cycli...
A critical issue in the long-term reliability of solder connections used in electronic packages is t...
The near eutectic 60Sn-40Pb alloy is the most commonly used solder for electrical interconnections i...
This study is devoted to providing a mechanistic rationale of coarsening induced failure in solder a...
The most commonly used solder for electrical interconnections in electronic packages is the near eut...
Microstructural evolution due to thermal effects was studied in micro solder joints (55 {+-} 5 {micr...
The most commonly used solder for electrical interconnections in electronic packages is the near eut...
This study examines the cyclic stress-strain response of solder joints in a surface mounted electron...
The fatigue of Sn–37 wt.% Pb model solder joints has been investigated under thermomechanical and th...
ABSTRACT: This pap damage initiation due to sue of damage evolution plasticity is modeled wi quantif...
The microstructure of solder plays a key role in the reliability of electronic packages. In this stu...
The effect of mechanical cycling fatigue damage and isothermal aging histories on the evolution of t...
As microelectronic package construction becomes more diverse and complex, the need for accurate, geo...
The thermomechanical fatigue failure of solder joints is increasingly becoming an important reliabil...
The most commonly used solder for electrical interconnects in electronic packages is the near eutect...
Thermal mechanical fatigue (TMF) is an important damage mechanism for solder joints exposed to cycli...
A critical issue in the long-term reliability of solder connections used in electronic packages is t...
The near eutectic 60Sn-40Pb alloy is the most commonly used solder for electrical interconnections i...
This study is devoted to providing a mechanistic rationale of coarsening induced failure in solder a...
The most commonly used solder for electrical interconnections in electronic packages is the near eut...
Microstructural evolution due to thermal effects was studied in micro solder joints (55 {+-} 5 {micr...
The most commonly used solder for electrical interconnections in electronic packages is the near eut...
This study examines the cyclic stress-strain response of solder joints in a surface mounted electron...
The fatigue of Sn–37 wt.% Pb model solder joints has been investigated under thermomechanical and th...
ABSTRACT: This pap damage initiation due to sue of damage evolution plasticity is modeled wi quantif...
The microstructure of solder plays a key role in the reliability of electronic packages. In this stu...
The effect of mechanical cycling fatigue damage and isothermal aging histories on the evolution of t...
As microelectronic package construction becomes more diverse and complex, the need for accurate, geo...